Coax – DC parametric test down to pA levels
-Movable platen with 40 mm height adjustment, 200 µm contact / separation stroke and ± 1 µm repeatability
-Chuck stage with adjustable friction & stage lock, unique Z chuck adjustment and 90 mm pull-out
-Magnetic positioners with 1 µm feature resolution and 3 linear axes with precision ball bearing

The Helios NanoLab™ 600 is equipped with an extremely high resolution Elstar™ electron column with a Field Emmission Gun (FEG) electron source. It is capable of <1nm @ 15kV and <2.5nm at 1kV electron beam resolution. The Ga+ ion source can image and machine down to 5nm resolution levels.

This Hitachi S-4500 field emission scanning electron microscope (FESEM) is capable of producing high-resolution images between 20 and 500k. The system is capable of accelerating voltages between 0.5-30 kV. With precision setup of the aperture and beam it is capable of capturing images with resolution of ~5 nm. The system can accommodate samples up to 2" in diameter on its manual three-dimension sample stage with tilt capability from 0° to 45°. Active image capture and analysis software provided by the Revolution 1.6 software allows analytical data and storage. The system is also equipped with an X-ray Energy Dispersive Spectroscopy

Laurell Spinner
The systems dynamically dispense chemistry onto a substrate, then rinse and dry it, along with the plumbing and process chamber. This dry in, dry out philosophy yields very repeatable results.

Nano Spectrophotometer BSNA-101
-Minimum Sample Size: 1-2.0 µl
-Wavelength Range: 260nm, 280nm
-Absorbance Range: 0.02-80A
-Absorbance Accuracy: 1% (7.332Abs at 260nm)
-Absorbance Precision: 0.005Abs

The Oxford system is a load-locked inductively coupled plasma etch tool that uses RF (600 watts 13.56MHz) for the RIE water-cooled electrode and 1.2 kW, 2 MHZ on the ICP driven electrode. The system currently uses Chlorine and Boron tri-chloride gases.

Thermal Evaporater
-Low-voltage resistive (thermal) evaporation
-High vacuum carbon coating
-High resolution microscopy coatings
- Rotary shadowing
-Aperture cleaning

The Vistec EBPG5200 is a high-end, state-of-the-art electron beam lithography system that can write to less than 8 nm in size on full 200 nm wafers or small sample pieces. The system uses a high current density thermal field emission gun for operation at 20, 50, and 100kV accelerating voltages. Rapid exposure is possible with up to 50 MHz write speeds and a 20-bit pattern generator. The system incorporates breakthroughs in enhanced resolution, noise reduction, and beam stability for the ultimate in nano-lithography.

The GCA Mann3600F pattern generator is capable of producing standard 5" x 5" (0.090" thick) or standard 4" x 4" (0.060" thick) chrome mask plates for use in optical lithography. The system is capable of creating mask features to as small as 2 um in size. The masks are originally designed in the L-Edit CAD system and then converted into a format that can be manipulated into data read by the pattern generator.